Snapdragon™ 845 Mobile HDK
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Powered by the top-tier Qualcomm® Snapdragon™ SDA845 processor.

Snapdragon™ 845 Mobile Hardware Development is our highest performance board platform powered by the top-tier Qualcomm® Snapdragon™ SDA845 processor. The HDK supports a QHD LCD panel (optional), HDMI out or DisplayPort over USB Type-C, 4K@60 Ultra HD H.264/H.265 encode and decode, 2x 16MP or 1x 32MP cameras, and many I/O expansion headers. This dev kit is ideally suited for OEMs and device makers to evaluate the processor and peripherals, and to jump-start premium mobile device or software development.

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Snapdragon™ 845 Mobile HDK Overview

The Snapdragon™ 845 Mobile HDK is our highest performance board platform powered by the top-tier Qualcomm® Snapdragon™ SDA845 processor. The HDK supports a QHD LCD panel (optional), HDMI out or DisplayPort over USB Type-C, 4K@60 Ultra HD H.264/H.265 encode and decode, 2x 16MP or 1x 32MP cameras, and many I/O expansion headers. This dev kit is ideally suited for OEMs and device makers to evaluate the processor and peripherals, and to jump-start premium mobile device or software development.

  • Powered by the Qualcomm® Snapdragon™ 845 Processor
  • Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
  • Mini-ITX form-factor — 170mm x 170mm
  • Android™ 9 Pie

Snapdragon™ 845 Mobile HDK Tech Specs

Processors

  • Qualcomm® Snapdragon™ SDA845 Octa-core 64-bit Kryo™ 385 CPU built on 10nm technology
    • 4X high-performance Kryo cores – up to 2.80 GHz
    • 4X low-power Kryo cores— up to 1.8 GHz
    • Qualcomm® Adreno™ 630 GPU OpenGL® ES 3.2, OpenCL™ 2.0 Full, Vulkan® 1.1, DX12
    • Qualcomm® Hexagon™ 685 DSP

Memory/Storage

  • 6GB LPDDR4x RAM
  • 128GB UFS2.1 Flash

Audio

  • Qualcomm® audio codec on-board
  • 1x US Standard CTIA Headset Jack
  • Analog audio input and output expansion headers

Video

  • Video Capture to 4K Ultra HD at 60fps, 10-bit HDR
  • Video Playback to 4K Ultra HD at 60fps, 10-bit HDR
  • H.264 (AVC), H.265 (HEVC)

OS Support

  • Android™ 8 Oreo™

Optional Accessories

Wireless

  • Qualcomm® Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MIMO + Bluetooth 5.0, with on-board antennas
  • WiGig60 802.11ad with on-board antenna

Power Management

  • Power and battery management

Display Interfaces

  • HDMI 1.4 via DSI -> HDMI bridge on board
  • DisplayPort over USB3.1 Type-C
  • 2x 4-lane MIPI DSI connector for optional LCD panel accessory

Camera Interfaces

  • 3x 4-lane + 1x 2-lane MIPI CSI ports on one 120 pin connector
  • Qualcomm® Spectra™ 280 ISPs

General I/O

  • 2x USB2.0 Type-A host (on-board hub)
  • 1x USB micro-B UART
  • NFC expansion header, sensor expansion header, with I2C, SPI, UART, GPIO

High Speed I/O

  • 1x USB3.1 Type-C with DisplayPort video out

Location

  • GNSS daughter card with GPS, GLONASS, COMPASS, and Galileo, PCB antenna and SMA connector option

Expansion Sockets

  • 1x PCIe interface to either: mini PCIe socket or PCIe 1X slot (one at a time)
  • uSD 3.0 UHS-1

Power Input

  • 12V/3A input from wall adapter (included) or 3000mAh Li-Ion battery (included)

Size

  • Mini-ITX form-factor — 170mm x 170mm

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Technologies Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Snapdragon™ 845 Mobile HDK Downloads

Additional Product Information
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RoHS and REACH Certificate Various Embedded Compute
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