Open-Q™ 6490CS SOM (System on Module)
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Based on Qualcomm® QCS6490 System-on-Chip

The Open-Q 6490CS provide flexible and effective AI/ML performance, low power consumption, and cost efficiency for edge device applications such as AI cameras, video collaboration, video telematics and industrial handhelds. Based on Qualcomm’s QCS6490, these products share exceptional characteristics, including a 6nm process, high performance, low power consumption, support for on-device machine learning and edge computing, Wi-Fi 6E, multiple camera interfaces, and up to 4K video encoding/decoding resolution.

With the release of the pin-compatible Open-Q 5430CS and Open-Q 6490CS, Lantronix offers our customers product choices that allow them to scale their product line with less investment and save time.

Lantronix offers TAA and NDAA compliant products with at least 10 years of longevity for the Open-Q 5430CS, Open-Q 6490CS, Open-Q 5165RB, Open-Q 8250CS, and Open-Q 8550CS with strict Bill-of-Material and quality control. Combined with over 20 years of hardware design and software development experience, and 1200+ successful projects, Lantronix will be your long-term partner, ensuring the ongoing success of your product journey.

 

NDAA CompliantTAA Compliant

Open-Q™ 6490CS SOM (System on Module) Overview

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Applications

  • AI Cameras
  • Multi-camera and smart camera systems
  • Video conferencing
  • Video telematics
  • Retail self-check-out
  • Digital signage
  • Drones
  • Rugged handhelds

Key Features

  • Qualcomm® QCS6490 SoC
  • Up to 8GB LPDDR5 RAM + 64GB eMMC
  • Support UFS and NMVe storage
  • Android™ 13 and Qualcomm Linux
  • On-device AI Engine up to 12.5 TOPS
  • Dedicated Computer Vision Engine
  • Multiple MIPI camera and display ports
  • Multiple high speed connectivity options
  • Ultra-compact 47 x 35 mm form factor

Open-Q™ 6490CS SOM (System on Module) Tech Specs

Processor 

  • Qualcomm® 6490 SoC built on 6nm technology:
  • Kryo™ 670 Octa-core CPU: 1 Prime @ 2.7 GHz + 3 Gold @ 2.4 GHz + 4 Silver @ 1.8 GHz
  • Hexagon™ 770 with Hexagon Vector eXtensions (HVX)
  • Adreno™ 643L GPU @ Fmax Spectra™
  • Spectra™ 570L ISP
  • Adreno™ 633 video processing unit
  • Adreno™ 1075 display processing unit
  • 6th Gen Qualcomm AI engine
  • Secure processing unit

Memory/Storage 

  • 4GB or 8GB LPDDR5 with 64GB eMMC configuration (other configurations available upon request)
  • Supports external UFS and NVMe storages

Wireless 

  • Supports external Wi-Fi via PCIe 1-lane, up to Wi-Fi 6E, 2×2 MU-MIMO + Bluetooth 5.2

Display Interfaces

  • 1x 4-lane MIPI DSI D-PHY 1.2, up to FHD+ touchscreen support
  • Support for USB3.1 Type-C with DisplayPort v1.4 and USB 2.0
  • Embedded DisplayPort (eDP)

Camera Interfaces 

  • 5x 4-lane MIPI CSI D-PHY 1.2 or C-PHY 1.2 with CCI I2C control
  • Spectra 570L ISP supporting 36 MP + 22 MP at 30 fps or three 22 MP at 30fps ZSL
  • 3x IFE, 2x IFE-lite, 5 concurrent MIPI CSI configurable in 4 + 4 + 4 + 4 + 4 configuration

Video Performance 

  • Video decode up to 4K60. Native decode for H.265/H.265/VP9
  • Video encode up to 4K30. Native encode for H.265/H.265; Support for HDR10 and HDR10+ playback
  • Concurrent 1080p60 Decode and 1080p60 Encode or 4K30 Decode and 4K30 Encode

Audio

  • Support interfaces to WCD938x/WCD937x high fidelity audio codec and WSA883x speaker amp on carrier board.
  • Hexagon™ audio DSP V66M

High Speed Connectivity 

  • 1x PCIe Gen3 2-lane; 1x PCIe Gen3 1-lane for connectivity
  • 1x USB 3.1 with support for Type-C + DisplayPort v1.4 with USB SS data concurrency
  • 1x USB 2.0

Operating Environment 

  • Input voltage: 3.8V nominal
  • Operating Temperature: commercial and industrial temperatures available

Power/Battery 

  • Power management on SOM

 

Form Factor 

  • 47 x 35 x 2.72 mm LGA

Software

  • Android™ 13 and Qualcomm Linux

I/O Interfaces 

  • 4-bit SD 3.0, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to dedicated Hexagon™ sensor DSP

 

 


*QCS6490 Chipset Performance, see SOM/SIP Release Notes for details on tested configurations and platforms.

Specifications are subject to change without notice. Not all features listed may be supported in software. All brand or product names are trademarks or registered trademarks of their respective owners. Qualcomm Snapdragon, Qualcomm Kryo, Qualcomm Spectra, Qualcomm Adreno, Fluence and Qualcomm Hexagon are products of Qualcomm Technologies, Inc. Qualcomm IZat is a product of Qualcomm Atheros, Inc. Qualcomm, Snapdragon, Adreno, Fluence and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kryo, Spectra and IZat are trademarks of Qualcomm Incorporated. Used with permission.

Lantronix and Open-Q and their respective logos are trademarks, registered and otherwise, of Lantronix Corporation in Canada, European Union, Taiwan, United States of America and other jurisdictions.

Open-Q™ 6490CS SOM (System on Module) Downloads

Additional Product Information

Additional technical documentation and firmware information can be found at Tech Portal HERE

Lantronix Part # Name Description Order Now
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Lantronix Part #
QC-SIP-6490CS-A
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4GB LPDDR5, 32GB eMMC

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Lantronix Part #
QC-SIP-6490CS-B
Name

4GB LPDDR5, 64GB eMMC

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Lantronix Part #
QC-SIP-6490CS-C
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8GB LPDDR5, 64GB eMMC

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Lantronix Part #
ES-QC-DK-6490CS
Name

Open-Q 6490 development kit bundle; Main board, 1x SOM (QC-SIP-6490CS-A), 1x IMX577 camera, 1x OV9282 camera, power supply, antenna and USB debug cable.

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