New
G520
Rugged LTE & 5G IoT Cellular Gateways
Bluetooth
Featured Products
New
Open-Q™ 610 µSOM Development Kit
-Powered by ultra-compact (50x25mm) Open-Q 610 µSOM
-Open-frame Mini-ITX Form-factor carrier board for evaluation and development
-Ethernet, 2x USB, µSD socket, GPIO, sensor board
-Optional LCD/touchscreen and cameras
-Wi-Fi / Bluetooth antenna on carrier board
-Yocto Linux™
New
Open-Q™ 2200 Series SIP
Based on the Qualcomm® QCS2290 (Android) & QRB2210 (Yocto Linux) processors with:
On-board audio codec
2GB of LPPDR4 memory
16GB of eMMC
Pre-certified Wi-Fi and Bluetooth
New
Open-Q™ 4200 Series SIP
Compact SIP with Qualcomm QCS4290 (Android) & QRB4210 (Yocto Linux) processors, 8-core 2.0/1.8 GHz processor
3rd generation Qualcomm AI Engine
Vivid graphics with Qualcomm Adreno 610 GPU
Multiple high speed connectivity options
Up to 6GB LPDDR4 and 256GB eMMC
Long term support with extended life hardware and software support through 2027
New
Open-Q™ 7230CS SOM (System on Module)
SOM with powerful specialized processing cores
On-device Qualcomm® AI Engine™ (7 TOPS) for machine vision, neural networks, deep learning workloads at low power
WiFi 6, Bluetooth Low Energy v5.1
New
Open-Q™ 8250CS SOM (System on Module)
SOM with powerful specialized processing cores
On-device Qualcomm® AI Engine™ (15 TOPS) for machine vision, neural networks, deep learning workloads at low power
Powerful image signal processor for up to 24 video streaming cameras
8K video encode/decode, up to 64MP photo and video capture
WiFi 6, Bluetooth Low Energy v5.1
New
Open-Q™ AL Development Kit
The Open-Q™ AL development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.
The development kit is compatible with the Open-Q™ 4290 and 2290 SIPs. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
New
Open-Q™ RB Development Kit
The Open-Q™ RB development kit is designed for rapid prototyping of new innovative products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations. It comprises separate hardware modules connected by high-speed and low-speed connectors. It is compliant with the 96Boards open hardware mezzanine expansion boards.
The development kit is compatible with the Open-Q™ 4210 and 2210 SIPs. Users can use the same development kit to evaluate or prototype with many SIP families from Lantronix.
New
SA515M CCARD – Qualcomm® Connected Car Application Reference Design
The SA515M-based CCARD provides a near commercial-grade Telematics Control Unit (TCU) that is the first telematics solution with a second-generation 5G modem and supports 5G NR (Sub-6), Dual SIM Dual Active + CV2X concurrency, and multi-frequency GNSS (Gen 9 core) along with dead reckoning GNSS.
New
Snapdragon™ 8 Gen 3 Mobile Hardware Development Kit
Snapdragon™ 8 Gen 3 Mobile Platform
Qualcomm® Snapdragon™ SM8650P
Products
SiP with powerful specialized processing cores
SiP with powerful specialized processing cores
On-device Qualcomm® AI Engine™ (12.5 TOPS)
SiP with powerful specialized processing cores
On-device Qualcomm® AI Engine™ (55 TOPS)
WiFi 6, Bluetooth Low Energy v5.3
Qualcomm® Kryo™Gen 6 octal-core CPU and Adreno™ 663 GPU
On-device Qualcomm® AI Engine™ (100 TOPS) for machine vision, neural networks, deep learning workloads at low power
Image signal processor supporting up to 16 concurrent video streaming cameras
Extended operating temperature range from -40°C to 115°C junction temperature
Focus
FOX Series
Focus
xPico 200 Series
Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security
Family:
Focus
xPico 250 Embedded IoT Gateway
Industrial-grade high performance Wi-Fi, Bluetooth, and Ethernet connectivity with enterprise security
Family:
Focus
xPico 270 Embedded IoT Gateway
Secure, Industrial-grade 802.11ac Wi-Fi, Bluetooth, and Ethernet connectivity
Family:
The CCARD provides a near commercial-grade Telematics Control Unit (TCU) that provides high-speed (1Gbps) wide area networking (WAN) connectivity from an automobile.
Powered by the Open-Q™ 2500 SOM (System on Module)
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Carrier board 170mm x 170mm,SOM 31.5mm x 15mm
Optimized Android™ for Wearables
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 2500 processor
Quad-Core ARM Cortex A7 (32-bit) at 1.094GHz
Dimensions 15mm x 31.5mm
Android™ 8 Oreo™ for Wearables
SOM with powerful specialized processing cores
On-device Qualcomm® AI Engine™ for machine vision, neural networks, deep learning
Power-efficient edge AI computing solution pushing 15 TOPS
Ubuntu 20.04 Linux with support for Robot Operating System 2.0
Container and accelerator APIs - Docker, TensorFlow Lite, NNAPI and others
- Production-ready SOM (System on Module) based on the Qualcomm® QCS610 SoC
- Kryo™ 460 Octa-core CPU, Adreno™ 612 GPU, Hexagon™ DSP
- Dimensions 50mm x 25mm
- Yocto Linux connected camera SDK
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 626 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 25mm x 50mm
Android™ 9, Android™ 10, Yocto Linux®
Powered by the Open-Q™ 626 µSOM (Micro System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 2.2GHz CPU (APQ 8053Pro)
Carrier board 170mm x 170mm
Android™ 9, Android™ 10, Yocto Linux®
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 660 processor
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Dimensions 25mm x 50mm
Android™ 9 Pie
Powered by the Open-Q™ 660 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 260 CPU, Adreno™ 512 GPU & Hexagon™ 680 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie
- Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 845 processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP with dual HVX51
- Dimensions 25mm x 50mm
- Android™ 9, Android™ 10, Yocto Linux®
Powered by the Open-Q™ 845 µSOM (Micro System on Module)
Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
Carrier board Mini-ITX 170mm x 170mm
Android™ 9 Pie, Android™ 10, Yocto Linux®
- Compatible with the micro-sized (50x29mm) Open-Q 865 family of SOMs
- Open-frame Mini-ITX Form-factor carrier board for evaluation and development
- Numerous I/O and connectivity options
- Optional LCD/touchscreen and cameras
- Wi-Fi and Bluetooth antennas on carrier board
- Production-ready SOM based on the powerful Qualcomm® SXR2130P
- Qualcomm® SXR2130P SoC built on 7nm technology
- Dimensions: 50mm x 29mm
- Android™ 10
Snapdragon™ 8 Gen 2 Mobile Platform
Qualcomm® Snapdragon™ SM8550P
Last Time Buy
Open-Q 835 µSOM Development Kit
Powered by the Open-Q™ 835 µSOM (Micro System on Module).
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with Dual HVX
Carrier board Mini-ITX 170mm x 170mm
Android™ 8 Oreo™, Android™ 9 Pie
Last Time Buy
Open-Q™ 410 Development Kit
Powered by the Open-Q™ 410 SOM (System on Module)
Quad-core 64-bit ARM® Cortex® A53, Adreno™ 306 GPU, Hexagon™ v5 DSP
Carrier board 130mm X 130mm, SOM 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Windows™ 10 IoT Core, Linux®
Last Time Buy
Open-Q™ 410 SOM (System on Module)
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 410 processor
Quad-core 64-bit ARM® Cortex®, Adreno™ 306 GPU & Hexagon™ v5 DSP
Dimensions 44mm x 26.5mm
Android™ 7 Nougat, Android™ 5 Lollipop, Linux®
Last Time Buy
Open-Q™ 624A Development Kit
Powered by the Open-Q™ 624A SOM (System on Module)
Octa-Core 64-bit ARM® Cortex™ A53 1.8GHz
Carrier board 170mm x 115mm
Android™ 8 Oreo™
Last Time Buy
Open-Q™ 624A SOM (System on Module)
Production-ready SOM (System on Module) based on the Qualcomm® Snapdragon™ 624 processor
Octa-Core 64-bit ARM® Cortex® A53, Adreno™ 506 GPU, Hexagon™ 546 DSP
Dimensions 46.5mm x 50mm
Android™ 8 Oreo™
Last Time Buy
Open-Q™ 820 µSOM Development Kit
Powered by the Open-Q™ 820 µSOM (Micro System on Module)
Quad-core 64-bit Kryo™ CPU, Adreno™ 530 GPU & Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 7 Nougat, Android™ 8 Oreo™, Linux®, Android™ 9 Pie
See the Open-Q™ 820 SOM vs. Open-Q™ 820 µSOM selection guide here
Last Time Buy
Open-Q™ 820Pro µSOM Development Kit
Powered by the Open-Q™ 820Pro µSOM (Micro System on Module)
Long-life, higher-speed, Qualcomm® Snapdragon™ 820E (APQ8096SG) SoC
Quad-core 64-bit Kryo™ CPU @ 2.342 GHz, Adreno™ 530 GPU @ 652.8 MHz, Hexagon™ 680 DSP with HVX
Carrier board 170mm X 170mm, SOM 50mm x 25mm
Android™ 9 Pie, Debian Linux®
Last Time Buy
Open-Q™ 835 µSOM (Micro System on Module)
Production-ready µSOM (Micro System on Module) based on the Qualcomm® Snapdragon™ 835 processor
Octa-core 64-bit Kryo™ CPU, Adreno™ 540 GPU & Hexagon™ DSP with dual HVX
Dimensions 25mm x 50mm
Android™ 8 Oreo™, Android™ 9 Pie
Last Time Buy
Qualcomm® Flight Pro™ Development Kit
Drone and Robotics research and development
Consumer Drone products
Aerial Robotics
Land Robotics
Embedded vision and navigation applications
Last Time Buy
Snapdragon™ 8 Gen 1 Mobile Hardware Development Kit
Snapdragon™ 8 Gen 1 Mobile Platform
Qualcomm® Snapdragon™ SM8450P – 64-bit octa-core Kryo™ 780 Processor
Main Board: 100 mm x 85 mm
Android™ 12
Last Time Buy
Snapdragon™ 845 Mobile HDK
- Powered by the Qualcomm® Snapdragon™ 845 Processor
- Octa-core 64-bit Kryo™ 385 CPU, Adreno™ 630 GPU & Hexagon™ 685 DSP
- Mini-ITX form-factor — 170mm x 170mm
- Android™ 9 Pie